<?xml version="1.0" encoding="gb2312"?><rss version="2.0"><channel><title>产品新闻</title><link></link><description></description><language>zh-cn</language><generator>Goodspeed Rss</generator><ttl>20</ttl><pubDate>Fri, 05 Dec 2008 01:19:52 GMT</pubDate><category></category><copyright></copyright><docs></docs><item><title>CSR推出RoadRunner2汽车组件开发平台</title><pubDate>Thu, 04 Dec 2008 01:04:00 GMT</pubDate><link>http://article.ednchina.com/Auto/20081202100024.htm</link><description>蓝牙连接及无线技术提供商CSR公司宣布推出其第二款成功的蓝牙车载免提组件设计方案——RoadRunner2</description><comments></comments><guid>http://article.ednchina.com/Auto/20081202100024.htm</guid><category></category><author>EDN China</author></item><item><title>应用材料公司推出创新的高性能TSV刻蚀系统Silvia&amp;#8482;</title><pubDate>Thu, 04 Dec 2008 00:07:00 GMT</pubDate><link>http://article.ednchina.com/EDA/20081204120838.htm</link><description>应用材料公司宣布推出Applied Centura&amp;amp;reg; Silvia&amp;amp;#8482; Etch刻蚀系统，该系统专为高效、低成本的TSV(through-silicon via穿透硅互连)应用而设计</description><comments></comments><guid>http://article.ednchina.com/EDA/20081204120838.htm</guid><category></category><author>EDN China</author></item><item><title>应用材料公司加快三维集成电路的TSV应用</title><pubDate>Thu, 04 Dec 2008 00:03:00 GMT</pubDate><link>http://article.ednchina.com/EDA/20081204120525.htm</link><description>应用材料公司正在努力加快TSVs（through-silicon vias穿透硅互连）的广泛应用。TSVs是一项正在快速发展的新工艺，它将集成电路垂直堆叠，在更小的面积上大幅提升芯片性能并增加芯片功能</description><comments></comments><guid>http://article.ednchina.com/EDA/20081204120525.htm</guid><category></category><author>EDN China</author></item><item><title>奥地利微电子具有嵌入式比特整形功能的FlexRay Active Star器件</title><pubDate>Wed, 03 Dec 2008 23:58:00 GMT</pubDate><link>http://article.ednchina.com/Embedded/20081204120247.htm</link><description>奥地利微电子公司推出具有嵌入式比特整形器的AS8224 FlexRay Active Star器件，适用于最受限的FlexRay系统参数解决方案</description><comments></comments><guid>http://article.ednchina.com/Embedded/20081204120247.htm</guid><category></category><author>EDN China</author></item><item><title>采用 4mm x 4mm QFN封装的36V 2MHz 降压型DC/DC稳压器和LDO控制器</title><pubDate>Wed, 03 Dec 2008 23:55:00 GMT</pubDate><link>http://article.ednchina.com/Power/20081203115836.htm</link><description>凌力尔特 推出采用 4mm x 4mm QFN 或 TSSOP-20E 封装的 36V、1.5A (ISW) 降压和升压型稳压器以及线性控制器 LT357</description><comments></comments><guid>http://article.ednchina.com/Power/20081203115836.htm</guid><category></category><author>EDN China</author></item><item><title>飞兆半导体的300mA低VIN LDO为数字应用提供高效率和节省空间优势</title><pubDate>Wed, 03 Dec 2008 23:53:00 GMT</pubDate><link>http://article.ednchina.com/Power/20081203115436.htm</link><description>飞兆半导体为对能量敏感的系统设计人员提供300mA低压降 (LDO) 稳压器解决方案，在效率、瞬态响应和占位面积方面实现平衡</description><comments></comments><guid>http://article.ednchina.com/Power/20081203115436.htm</guid><category></category><author>EDN China</author></item><item><title>Xilinx 汽车光流解决方案满足高级驾驶辅助系统的图像处理要求</title><pubDate>Wed, 03 Dec 2008 23:49:00 GMT</pubDate><link>http://article.ednchina.com/Auto/20081203115204.htm</link><description>赛灵思在 Electronica 2008 展会上展示了针对视觉化驾驶辅助（DA）系统的赛灵思汽车光流（XA Optical Flow）解决方案</description><comments></comments><guid>http://article.ednchina.com/Auto/20081203115204.htm</guid><category></category><author>EDN China</author></item><item><title>R&amp;S力推CMMB数字多媒体广播与测试解决方案</title><pubDate>Wed, 03 Dec 2008 23:44:00 GMT</pubDate><link>http://article.ednchina.com/TM/20081203114723.htm</link><description>R&amp;amp;amp;S公司将在其SFU/SFE/SFE100系列测试发射机中升级CMMB的信道编码模块</description><comments></comments><guid>http://article.ednchina.com/TM/20081203114723.htm</guid><category></category><author>EDN China</author></item><item><title>兼容标准，引领未来 — R&amp;S EMC测试方案与系统</title><pubDate>Wed, 03 Dec 2008 23:43:00 GMT</pubDate><link>http://article.ednchina.com/TM/20081203114416.htm</link><description>2008年11月18至20日，在上海光大会展中心举办的第七届中国上海国际电磁兼容技术与安规认证展览会上，R&amp;amp;amp;S公司为您展示了其全面领先的电磁兼容性测试解决方案</description><comments></comments><guid>http://article.ednchina.com/TM/20081203114416.htm</guid><category></category><author>EDN China</author></item><item><title>Mirics与展讯建立战略合作伙伴关系，推出基于CMMB解决方案的PCTV应用产品</title><pubDate>Wed, 03 Dec 2008 23:35:00 GMT</pubDate><link>http://article.ednchina.com/CE/20081203113807.htm</link><description>Mirics半导体公司与展讯通信有限公司宣布建立战略合作伙伴关系， 双方将针对便携式个人计算机（ PC ）平台，提供基于中国移动多媒体广播（ CMMB ）标准的创新嵌入式电视解决方案</description><comments></comments><guid>http://article.ednchina.com/CE/20081203113807.htm</guid><category></category><author>EDN China</author></item><item><title>业内首款兼容Windows Vista的D类音频子系统</title><pubDate>Wed, 03 Dec 2008 23:30:00 GMT</pubDate><link>http://article.ednchina.com/CE/20081203113242.htm</link><description> Maxim推出业内首款兼容Windows Vista&amp;amp;reg;的音频子系统IC MAX9791/MAX9792，用于笔记本电脑</description><comments></comments><guid>http://article.ednchina.com/CE/20081203113242.htm</guid><category></category><author>EDN China</author></item><item><title>恩智浦SmartMX IC以出色性能获得MasterCard&amp;reg; PayPass&amp;#8482;认证</title><pubDate>Wed, 03 Dec 2008 23:27:00 GMT</pubDate><link>http://article.ednchina.com/EDA/20081203112935.htm</link><description>恩智浦半导体宣布其非接触银行芯片——SmartMX P5CD012应用到奥地利卡公司的银行卡中（半天线尺寸），该芯片具有行业标竿385毫秒的交易速度，并已得到MasterCard&amp;amp;reg;（以下简称万事达卡）PayPass&amp;amp;#8482;认证</description><comments></comments><guid>http://article.ednchina.com/EDA/20081203112935.htm</guid><category></category><author>EDN China</author></item><item><title>XMOS推出全新封装和定价的XS1-G4可编程器件</title><pubDate>Tue, 02 Dec 2008 22:00:00 GMT</pubDate><link>http://article.ednchina.com/PLDFPGA/20081202100154.htm</link><description>软件化芯片创建企业XMOS日前推出了其G4可编程器件的一款新型封装形式，它是XS1-G4系列的第一款产品</description><comments></comments><guid>http://article.ednchina.com/PLDFPGA/20081202100154.htm</guid><category></category><author>EDN China</author></item><item><title>研诺推出动态管理系统负载和充电的电池充电器</title><pubDate>Tue, 02 Dec 2008 21:57:00 GMT</pubDate><link>http://article.ednchina.com/Power/20081202095832.htm</link><description>研诺宣布推出产品编号为AAT3672的一款高集成度的、单体锂离子/高分子电池充电器和系统管理芯片</description><comments></comments><guid>http://article.ednchina.com/Power/20081202095832.htm</guid><category></category><author>EDN China</author></item><item><title>德州仪器推出单电源自动归零传感器放大器</title><pubDate>Tue, 02 Dec 2008 21:55:00 GMT</pubDate><link>http://article.ednchina.com/Analog/20081202095647.htm</link><description>德州仪器 (TI) 宣布推出一款单电源自动归零桥接传感器放大器 PGA308。该器件支持可编程增益与偏置，可放大传感器信号，并实现归零（偏置）与扩展（增益）的数字校准</description><comments></comments><guid>http://article.ednchina.com/Analog/20081202095647.htm</guid><category></category><author>EDN China</author></item><item><title>德州仪器1.5A线性电池充电器可最大化AC适配器与USB输入功率</title><pubDate>Tue, 02 Dec 2008 21:52:00 GMT</pubDate><link>http://article.ednchina.com/Power/20081202095454.htm</link><description>德州仪器 (TI) 宣布针对智能电话及其它便携式电子产品应用推出四款具备集成型 FET 的 28V、1.5A 线性充电管理 IC － bq2407x系列</description><comments></comments><guid>http://article.ednchina.com/Power/20081202095454.htm</guid><category></category><author>EDN China</author></item><item><title>Axiom Microdevices扩展GSM/GPRS功率放大器产品系列</title><pubDate>Tue, 02 Dec 2008 21:47:00 GMT</pubDate><link>http://article.ednchina.com/Analog/20081202094937.htm</link><description>Axiom Microdevices有限公司宣布推出AX508功率放大器(PA)，继续扩大它的产品供应版图, 将CMOS的全部优点带给客户。</description><comments></comments><guid>http://article.ednchina.com/Analog/20081202094937.htm</guid><category></category><author>EDN China</author></item><item><title>赛普拉斯推出针对气压、湿度、温度和环境光的 PSoC&amp;reg; 无线环境感应套件</title><pubDate>Tue, 02 Dec 2008 21:43:00 GMT</pubDate><link>http://article.ednchina.com/EDA/20081202094548.htm</link><description>赛普拉斯宣布推出 CY3271-EXP1 环境感应套件。该套件是最近推出的具有 CyFi&amp;amp;#8482; Low-Power RF 功能的 PSoC First Touch&amp;amp;#8482; 入门套件的第一款扩展套件</description><comments></comments><guid>http://article.ednchina.com/EDA/20081202094548.htm</guid><category></category><author>EDN China</author></item><item><title>LinkSwitch&amp;reg;-II设计手机充电器，空载功耗可达到五星级标准</title><pubDate>Tue, 02 Dec 2008 21:41:00 GMT</pubDate><link>http://article.ednchina.com/CE/20081202094304.htm</link><description>Power Integrations公司宣布，其LinkSwitch-II系列功率转换IC可使手机充电器制造商达到最近发布的五星级空载功耗标准。</description><comments></comments><guid>http://article.ednchina.com/CE/20081202094304.htm</guid><category></category><author>EDN China</author></item><item><title>凌力尔特公司推出反激式控制器</title><pubDate>Tue, 02 Dec 2008 21:02:00 GMT</pubDate><link>http://article.ednchina.com/Power/20081202090356.htm</link><description>凌力尔特公司 (Linear Technology Corporation) 推出反激式控制器 LT3751，该器件可将大型电容器迅速充电至高达 1000V。</description><comments></comments><guid>http://article.ednchina.com/Power/20081202090356.htm</guid><category></category><author>EDN China</author></item></channel></rss>