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TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTSutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
A1utGednc |
PreconditioningutGednc |
PCutGednc |
77utGednc |
|
A2utGednc |
Temperature Humidity-Bias or Biased HASTutGednc |
THB or HASTutGednc |
77utGednc |
|
A3utGednc |
Autoclave or Unbiased HAST or Temperature Humidity (without Bias)utGednc |
AC or UHST or THutGednc |
77utGednc |
|
A4utGednc |
Temperature CyclingutGednc |
TCutGednc |
77utGednc |
|
A5utGednc |
Power Temperature CyclingutGednc |
PTCutGednc |
45utGednc |
|
A6utGednc |
High Temperature Storage LifeutGednc |
HTSLutGednc |
45utGednc |
|
TEST GROUP B – ACCELERATED LIFETutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
B1utGednc |
High Temperature Operating LifeutGednc |
HTOLutGednc |
77utGednc |
|
B2utGednc |
Early Life Failure RateutGednc |
ELFRutGednc |
800utGednc |
|
B3utGednc |
NVM Endurance, Data Retention, and Operational LifeutGednc |
EDRutGednc |
77utGednc |
|
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTSutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
C1utGednc |
Wire Bond ShearutGednc |
WBSutGednc |
30 bonds from a minimum of 5 devicesutGednc |
|
C2utGednc |
Wire Bond PullutGednc |
WBPutGednc |
|
C3utGednc |
SolderabilityutGednc |
SDutGednc |
15utGednc |
|
C4utGednc |
Physical DimensionsutGednc |
PDutGednc |
10utGednc |
|
C5utGednc |
Solder Ball ShearutGednc |
SBSutGednc |
5 balls from a min. of 10 devicesutGednc |
|
C6utGednc |
Lead IntegrityutGednc |
LIutGednc |
from each 10 leadsutGednc
of 5 partsutGednc |
|
TEST GROUP D – DIE FABRICATION RELIABILITY TESTSutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
D1utGednc |
ElectromigrationutGednc |
EMutGednc |
---utGednc |
|
D2utGednc |
Time Dependent Dielectric BreakdownutGednc |
TDDButGednc |
---utGednc |
|
D3utGednc |
Hot Carrier InjectionutGednc |
HCIutGednc |
---utGednc |
|
D4utGednc |
Negative Bias Temperature InstabilityutGednc |
NBTIutGednc |
---utGednc |
|
D5utGednc |
Stress MigrationutGednc |
SMutGednc |
---utGednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTSutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
E1utGednc |
Pre- and Post-Stress Function/ParameterutGednc |
TESTutGednc |
AllutGednc |
|
E2utGednc |
Electrostatic Discharge Human Body ModelutGednc |
HBMutGednc |
See Test MethodutGednc |
|
E3utGednc |
Electrostatic Discharge Charged Device ModelutGednc |
CDMutGednc |
See Test MethodutGednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTS (CONTINUED)utGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
E4utGednc |
Latch-UputGednc |
LUutGednc |
6utGednc |
|
E5utGednc |
Electrical DistributionsutGednc |
EDutGednc |
30utGednc |
|
E6utGednc |
Fault GradingutGednc |
FGutGednc |
---utGednc |
|
E7utGednc |
CharacterizationutGednc |
CHARutGednc |
---utGednc |
|
E9utGednc |
Electromagnetic CompatibilityutGednc |
EMCutGednc |
1utGednc |
|
E10utGednc |
Short Circuit CharacterizationutGednc |
SCutGednc |
10utGednc |
|
E11utGednc |
Soft Error RateutGednc |
SERutGednc |
3utGednc |
|
E12utGednc |
Lead (Pb) FreeutGednc |
LFutGednc |
See Test MethodutGednc |
|
TEST GROUP F – DEFECT SCREENING TESTSutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
F1utGednc |
Process Average TestingutGednc |
PATutGednc |
---utGednc |
|
F2utGednc |
Statistical Bin/Yield AnalysisutGednc |
SBAutGednc |
---utGednc |
|
TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTSutGednc |
|
#utGednc |
STRESSutGednc |
ABVutGednc |
SAMPLE SIZE / LOTutGednc |
|
G1utGednc |
Mechanical ShockutGednc |
MSutGednc |
15utGednc |
|
G2utGednc |
Variable Frequency VibrationutGednc |
VFVutGednc |
15utGednc |
|
G3utGednc |
Constant AccelerationutGednc |
CAutGednc |
15utGednc |
|
G4utGednc |
Gross/Fine LeakutGednc |
GFLutGednc |
15utGednc |
|
G5utGednc |
Package DroputGednc |
DROPutGednc |
5utGednc |
|
G6utGednc |
Lid TorqueutGednc |
LTutGednc |
5utGednc |
|
G7utGednc |
Die ShearutGednc |
DSutGednc |
5utGednc |
|
G8utGednc |
Internal Water VaporutGednc |
IWVutGednc |
5utGednc
满足AEC-Q100仅仅只是车规芯片的第一步，其实要求真正的达到车规芯片的质量，还需要从设计开发流程体系，生产制造体系各个方面来把控，才能真正的满足汽车的质量要求。
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最前沿的电子设计资讯
