|
TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTSxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
A1xrnednc |
Preconditioningxrnednc |
PCxrnednc |
77xrnednc |
|
A2xrnednc |
Temperature Humidity-Bias or Biased HASTxrnednc |
THB or HASTxrnednc |
77xrnednc |
|
A3xrnednc |
Autoclave or Unbiased HAST or Temperature Humidity (without Bias)xrnednc |
AC or UHST or THxrnednc |
77xrnednc |
|
A4xrnednc |
Temperature Cyclingxrnednc |
TCxrnednc |
77xrnednc |
|
A5xrnednc |
Power Temperature Cyclingxrnednc |
PTCxrnednc |
45xrnednc |
|
A6xrnednc |
High Temperature Storage Lifexrnednc |
HTSLxrnednc |
45xrnednc |
|
TEST GROUP B – ACCELERATED LIFETxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
B1xrnednc |
High Temperature Operating Lifexrnednc |
HTOLxrnednc |
77xrnednc |
|
B2xrnednc |
Early Life Failure Ratexrnednc |
ELFRxrnednc |
800xrnednc |
|
B3xrnednc |
NVM Endurance, Data Retention, and Operational Lifexrnednc |
EDRxrnednc |
77xrnednc |
|
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTSxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
C1xrnednc |
Wire Bond Shearxrnednc |
WBSxrnednc |
30 bonds from a minimum of 5 devicesxrnednc |
|
C2xrnednc |
Wire Bond Pullxrnednc |
WBPxrnednc |
|
C3xrnednc |
Solderabilityxrnednc |
SDxrnednc |
15xrnednc |
|
C4xrnednc |
Physical Dimensionsxrnednc |
PDxrnednc |
10xrnednc |
|
C5xrnednc |
Solder Ball Shearxrnednc |
SBSxrnednc |
5 balls from a min. of 10 devicesxrnednc |
|
C6xrnednc |
Lead Integrityxrnednc |
LIxrnednc |
from each 10 leadsxrnednc
of 5 partsxrnednc |
|
TEST GROUP D – DIE FABRICATION RELIABILITY TESTSxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
D1xrnednc |
Electromigrationxrnednc |
EMxrnednc |
---xrnednc |
|
D2xrnednc |
Time Dependent Dielectric Breakdownxrnednc |
TDDBxrnednc |
---xrnednc |
|
D3xrnednc |
Hot Carrier Injectionxrnednc |
HCIxrnednc |
---xrnednc |
|
D4xrnednc |
Negative Bias Temperature Instabilityxrnednc |
NBTIxrnednc |
---xrnednc |
|
D5xrnednc |
Stress Migrationxrnednc |
SMxrnednc |
---xrnednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTSxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
E1xrnednc |
Pre- and Post-Stress Function/Parameterxrnednc |
TESTxrnednc |
Allxrnednc |
|
E2xrnednc |
Electrostatic Discharge Human Body Modelxrnednc |
HBMxrnednc |
See Test Methodxrnednc |
|
E3xrnednc |
Electrostatic Discharge Charged Device Modelxrnednc |
CDMxrnednc |
See Test Methodxrnednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTS (CONTINUED)xrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
E4xrnednc |
Latch-Upxrnednc |
LUxrnednc |
6xrnednc |
|
E5xrnednc |
Electrical Distributionsxrnednc |
EDxrnednc |
30xrnednc |
|
E6xrnednc |
Fault Gradingxrnednc |
FGxrnednc |
---xrnednc |
|
E7xrnednc |
Characterizationxrnednc |
CHARxrnednc |
---xrnednc |
|
E9xrnednc |
Electromagnetic Compatibilityxrnednc |
EMCxrnednc |
1xrnednc |
|
E10xrnednc |
Short Circuit Characterizationxrnednc |
SCxrnednc |
10xrnednc |
|
E11xrnednc |
Soft Error Ratexrnednc |
SERxrnednc |
3xrnednc |
|
E12xrnednc |
Lead (Pb) Freexrnednc |
LFxrnednc |
See Test Methodxrnednc |
|
TEST GROUP F – DEFECT SCREENING TESTSxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
F1xrnednc |
Process Average Testingxrnednc |
PATxrnednc |
---xrnednc |
|
F2xrnednc |
Statistical Bin/Yield Analysisxrnednc |
SBAxrnednc |
---xrnednc |
|
TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTSxrnednc |
|
#xrnednc |
STRESSxrnednc |
ABVxrnednc |
SAMPLE SIZE / LOTxrnednc |
|
G1xrnednc |
Mechanical Shockxrnednc |
MSxrnednc |
15xrnednc |
|
G2xrnednc |
Variable Frequency Vibrationxrnednc |
VFVxrnednc |
15xrnednc |
|
G3xrnednc |
Constant Accelerationxrnednc |
CAxrnednc |
15xrnednc |
|
G4xrnednc |
Gross/Fine Leakxrnednc |
GFLxrnednc |
15xrnednc |
|
G5xrnednc |
Package Dropxrnednc |
DROPxrnednc |
5xrnednc |
|
G6xrnednc |
Lid Torquexrnednc |
LTxrnednc |
5xrnednc |
|
G7xrnednc |
Die Shearxrnednc |
DSxrnednc |
5xrnednc |
|
G8xrnednc |
Internal Water Vaporxrnednc |
IWVxrnednc |
5xrnednc
满足AEC-Q100仅仅只是车规芯片的第一步，其实要求真正的达到车规芯片的质量，还需要从设计开发流程体系，生产制造体系各个方面来把控，才能真正的满足汽车的质量要求。
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最前沿的电子设计资讯
